A heat sink is one of the most basic components in cooling an electronic device. For any heat source that cannot be cooled by its own conduction and needs to be cooled more efficiently than a heat sink, a heat sink is required to move the heat away from the source and dissipate it through more optimized conduction or convection. The radiator is mainly composed of a base and fins. The base is usually the flat surface that is in contact with the heat source and spreads the heat from the hot spot to the fin. The fins can be cut or constructed into any number of geometries that are usually perpendicular to the base to spread the heat. The goal is to optimize the surface area of the heat sink so that the most heat can be transferred and dissipated. With very few exceptions, heat sinks are made of thermally conductive metals, most commonly aluminum. With a thermal conductivity of 235 watts per Kelvin per meter, aluminum is lightweight and inexpensive, making it ideal for lighter, more cost-effective heat sinks. Copper is also a popular choice. Although copper is more expensive and heavier, it may be necessary for high performance applications due to its high thermal conductivity at 400 W/mK.
The radiator has relatively high requirements for CNC machining services, especially the error, which is within 0.001mm, and also has strict requirements on the material of aluminum products.